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HOME > Depo. at Request > System |
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MOCVD-1 |
Size of wafers : |
φ200mm （applicable to φ150mm by changing parts.） | |||||||||
Temperature for film deposition : |
Max. 700°C |  |
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Simultaneously usable materials : |
Max. 4 systems | ||||||||||
MOCVD-2 |
Size of wafers : |
φ200mm | |||||||||
Temperature for film deposition : |
Max. 550°C | ||||||||||
Simultaneously usable materials : |
Max. 3 systems | ||||||||||
MOCVD-3 |
Size of wafers : |
φ200mm | |||||||||
Temperature for film deposition : |
Max. 550°C | ||||||||||
Simultaneously usable materials : |
Max. 4 systems | ||||||||||
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Environment for film deposition |
Designated clean room :
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CLASS1000 |  |
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| Installation of systems, | |||||||||||
| Purification of the maintenance environment | |||||||||||
Designated clean booth : |
CLASS10 | ||||||||||
| To feed and eject cassette wafers, | |||||||||||
| Purification of the control environment | |||||||||||
Designated clean bench : |
CLASS10 | ||||||||||
| Storage of cassette, | |||||||||||
| Purification of the wafers delivery process | |||||||||||
The inspection environment |
Fluorescent X ray analysis system : |
To confirm composition and film
thickness (beyond the warranty). |
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| RIGAKU / System 3272 NEW | |||||||||||
Resistivity measuring system : |
To measure resistivity of metal film. | ||||||||||
| DIA INSTRUMENTS / MCP-T610 | |||||||||||
Electric characteristics evaluation system : |
To confirm ferroelectric characteristics (preparing). | ||||||||||
| Radiant / PrecisionLC | |||||||||||
The cleaning environment |
Wet etching draft : |
Cleaning of parts of the system. | |||||||||
Clean oven : |
Drying of parts after cleaning. | ||||||||||
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| SBT, PZT, BLT, BNT, BIT | |||||||||||
| Ir, IrOx, TiOx, Ta2O5, ZrOx, LaOx, Al2O3, Ru, RuOx, Pt, HfOx, ZnO, STO, YBCO, LiTaO3 | |||||||||||
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| Measurement of film thickness and composition (measured only at the center point), inspection (visual) of breakage, cracks, and chipping. | |||||||||||
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| As a rule, customers are expected to supply wafers. *At customers’ request, we will prepare wafers to be paid. | |||||||||||
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| Our resistivity measuring system is able to measure resistivity of metal film. | |||||||||||
| By consigning to supporting companies, we are able to meet requirement in great variety such as XRD (X ray diffraction) inspection, SEM observation, TEM observation, AFM observation, SIMS observation, patterning processing, pre/post cleaning, sputtering film deposition. | |||||||||||
Make inquiries about film deposition consignment from here. |
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